What is the difference between ENIG and Enepig?
ENEPIG is similar to ENIG in both utilize electro-less nickel on top of copper plating; the difference is while ENIG has gold deposited directly on top of nickel, ENEPIG has an additional layer of palladium between the nickel and final gold layer (see below Fig.
What does Enepig stand for?
ENEPIG is an acronym for Electroless Nickel Electroless Palladium Immersion Gold. This type of finish offers abundant benefits that make it suitable for a variety of applications.
Is Enepig lead free?
ENEPIG came through with flying colors as it formed one of the most robust solder joints with lead-free SAC type alloys.
What is Enepig plating?
ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a type of surface plating applied on a Printed Circuit Board to protect it from environmental factors during storage and operation.
Can you wire bond to ENIG?
ENIG is an ideal surface for aluminum wire bonding. However, with only 2- 4 micro-inches of gold it is not suitable for gold wire bonding. Soft gold at 10 – 25 micro-inches is needed for successful gold wire bonding.
What is black pad?
Black pad is a term that usually refers to nickel corrosion on electroless nickel and gold immersion (ENIG) surface finishes on PCBs. The defect is not seen as part of normal QC procedures as the immersion gold masks the appearance of the nickel under the gold.
What is HASL finish?
HASL is the predominant surface finish used in the industry. The process consists of immersing circuit boards in a molten pot of a tin/lead alloy and then removing the excess solder by using ‘air knives’, which blow hot air across the surface of the board.
What causes black pad?
In short, “Black Pad” is caused by too much phosphorus, and or contamination in the nickel plating bath. It is not visually detected prior to assembly because gold is plated over the nickel.
What is OSP finish?
Brief Introduction of OSP OSP is short for “organic solderability preservatives”, and it’s also called anti-tarnish. It refers to a layer of organic finish generated on clean and bare copper by adsorption. On the one hand, this organic finish is capable of stopping copper from being oxide, thermal shock or moisture.